YANLING Industrial Computer Technology (Shenzhen) Co., Ltd
An industrial computer enclosure is more than an outer shell. It affects heat dissipation, installation, interface accessibility and the overall durability of the system.
YANLING develops and manufactures industrial computer enclosures for fanless industrial computers, embedded industrial computers, industrial mini PCs, industrial touch screen PCs and network appliances. We can help customers select an existing chassis or evaluate a customized mechanical design according to motherboard dimensions, I/O layout, cooling requirements and installation conditions.
Our enclosure solutions include aluminum alloy cases, fanless heatsink housings, compact embedded cases and rackmount chassis.
 | Aluminum Alloy & Fanless ChassisCombining Mechanical Structure with Thermal Design YANLING uses aluminum alloy chassis in selected industrial PC products. Aluminum offers a combination of lightweight construction, mechanical strength and thermal conductivity. For fanless computers, the enclosure can also function as a passive heatsink. Our mechanical design considers the thermal contact area, heat-conducting structure and cooling fins to help transfer heat away from internal components. Available product examples include all-aluminum alloy fanless chassis with customized color options and hard-anodized surfaces. The exact material specification and surface treatment depend on the model. |
Enclosure type | Typical design |
|---|---|
Fanless box PC case | Aluminum alloy, passive cooling |
Embedded PC enclosure | Compact structure, equipment integration |
Touch panel PC housing | Aluminum case, front-panel integration |
Rackmount chassis | 1U rackmount cabinet |
Network appliance case | Multi-LAN interface layout |
YANLING also supports different installation methods, including desktop, wall-mounted, embedded and VESA mounting on applicable models. For rackmount applications, selected products use an aluminum alloy front panel with an SGCC cabinet.
Make the Enclosure Match Your Brand
Customers can discuss appearance and branding requirements as part of an OEM/ODM project.
Customized chassis color, including titanium gray options
Product logo through laser engraving or silk-screen printing
Customized product appearance and enclosure structure
Customized packaging and product labels
Mechanical modifications for project-specific requirements
Depending on the material and manufacturing process, surface treatment options can include anodizing, powder coating and electrophoretic coating. Final finish and color are subject to technical evaluation.
YANLING follows a structured OEM/ODM development process:
Requirement confirmation: Review motherboard dimensions, components, interfaces and installation conditions.
Mechanical design: Develop the enclosure structure and appearance around the hardware.
Engineering evaluation: Check I/O openings, mounting positions, cooling structure and assembly requirements.
Sample production: Produce and review samples before final approval.
Testing and adjustment: Evaluate the sample and make necessary design adjustments.
Mass production: Proceed with production after the configuration is confirmed.
Our manufacturing resources include CNC chassis machining, R&D, assembly and product testing. This allows enclosure development to be coordinated with the actual industrial computer hardware.
Whether you need a modified existing case or a new enclosure for a customized industrial computer, YANLING can evaluate the project from mechanical design through sample production and manufacturing.
We work with customers to coordinate the chassis, motherboard, cooling structure, I/O configuration, mounting design and product appearance. Our goal is to deliver an enclosure that fits the hardware, installation environment and brand requirements.
Send us your product dimensions, motherboard layout, interface requirements, installation method and preferred appearance. Our team can evaluate the mechanical design and recommend a suitable OEM/ODM development approach.
